Testing

At QSIC, we specialize in executing customer-defined inspection and testing requirements with the precision, traceability, and compliance needed for mission-critical manufacturing. Our services are built around IPC Class II, ITAR, and customer-specific protocols — not just general best practices.

Unlike many EMS providers who treat inspection as a post-process step, QSIC integrates test and inspection directly into the production workflow. Every assembly passes through structured checkpoints to catch issues early and protect final build integrity.

All SMT and BGA assemblies undergo full Automated Optical Inspection and X-ray analysis as a standard process — never optional. These inspections validate solder joint integrity, polarity, placement, and voiding in accordance with IPC and customer requirements.

QSIC performs fully documented FAI on every new or revised build, using customer-supplied drawings, BOMs, and notes. FAI data is reviewed, signed, and retained — supporting audits, source inspections, and repeatability across future builds.

We execute customer-defined test protocols, including Functional Test (FCT), In-Circuit Test (ICT), Flying Probe, and continuity/resistance testing. Our team follows your supplied procedures using your fixtures and test equipment, with full result logging and pass/fail traceability.

Each build undergoes detailed visual inspection to IPC Class II or III standards, as defined by your program. Certified inspectors perform and document checkpoints throughout the process. We also support customer or third-party source inspections as required.

QSIC does not design test procedures. We follow your specifications with accuracy and traceability — delivering clean, test-ready builds that meet your standards from the first unit to the last.